The 6th Thai – Japan Die and Mould Technology Symposium (JSDMT)

The 6th Thai – Japan Die and Mould Technology Symposium (JSDMT)

22 Nov 2017, 08:30 - 17:20

at Grand Hall 201, 2nd Floor BITEC, Bangkok

Language:
Thai (Thailand)

“Automotive and Business Trend for Operating Japanese Companies in Thailand and Thailand Departments”

ร่วมจัดโดย The Bureau of Supporting Industries Development  (BSID) & Thai-German Institute (TGI) & Thai Tool and Die Industry Association  (TDIA) & The Japan Society for Die and Mould Technology (JSDMT) & Reed Tradex

Remark: Seminar will be conducted in Japanese and Thai.

Click here to pre-registration

Contributors

  • Prof. Hideki AOYAMA

    Speaker

    President

    The Japan Society for Die and Mould Technology (JSDMT)

    Opening Speech "6th Thai – Japan Die and Mould Technology Symposium"

  • Dr. Yoshinori MAEKAWA

    Speaker

    Advisor

    Alliance for Supporting Industries Association (Thailand)

    “Expectation to Japanese Automotive and Parts Makers by New Projects of Thailand 4.0 and EEC”   

  • Mr. Takanobu ITO

    Speaker

    General Manager, Tool & Die Manufacturing Division

    CANON Hi-TECH (THAILAND) CO., LTD.

    “The Operational Issues and Training Examples at Die factory in Thailand” 

  • Mr. Seiya SASAKI

    Speaker

    President

    HONDA Engineering Asian Co., Ltd.

    “Future Development of Die & Mold in Asia”

  • Mr. Norihisa ADACHI

    Speaker

    General Manager, Production Engineering Div.

    MAZDA Motor Corporation

    “Monotsukuri in Mazda Providing Brightness for Customers”

  • Mr. Tatsanai TAESUJARIYA

    Speaker

    Press Project Engineering Manager, Production Engineering, Body Assembly Engineering Dept.

    NISSAN MOTOR(THAILAND) CO., LTD.

    “Job Localization and Engineer Skill Improvement in Nissan”

  • Mr. Akitoshi SATSUKI

    Speaker

    Executive Vice President

    Toyota Daihatsu Engineering & Manufacturing Co., Ltd. & Toyota Motor Thailand. Co., Ltd.

    “TOYOTA Step of the Press Die in Asia and Challenge to the Future -from IMV to TNGA”

Documents

  • Program 352 KB

    Conference Program for The 6th Thai – Japan Die and Mould Technology Symposium

    16 Nov 2017

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